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Papua New Guinea SiC High-Temperature Oxidation Furnace

♦ Application Fields: Compound Semiconductors Relevant Industries: Compound Semiconductors ♦ Suitable Material: SiC Ideal for Processing: Silicon Carbide (SiC) ♦ Wafer Size: 8/6 inches ♦ Applicable Process: High-Temperature Oxidation

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Papua New GuineaVertical Furnace Tube Equipment

Papua New GuineaSemiconductor chip equipment

Papua New GuineaSiC High-Temperature Oxidation Furnace

Product Description

Product Applications:

♦Applicable Fields: Compound Semiconductors Relevant Industries: Compound Semiconductors

♦Applicable Material: SiC – Suitable for Processing: Silicon Carbide (SiC)

♦ Wafer Size: 8/6 inches

♦ Applicable Process: High-Temperature Oxidation

 

Technical Specifications / Technical Parameters:

♦ Process Temperature Range: 800°C–1600°C

♦ Batch Size: 50 pieces Batch Capacity: 50 pcs