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Papua New Guinea SiC High-Temperature Annealing Furnace

♦ Application Fields: Compound Semiconductors Relevant Industries: Compound Semiconductors ♦ Suitable Material: SiC Suitable for Processing: Silicon Carbide (SiC) ♦ Wafer Size: 8/6 inches Wafer Size: 8/6 inch ♦ Applicable Processes: High-Temperature Annealing Applicable Processes: Annealing of SiC and GaN wafers

Category:

Papua New GuineaVertical Furnace Tube Equipment

Papua New GuineaSemiconductor chip equipment

Papua New GuineaSiC High-Temperature Annealing Furnace

Product Description

Product Applications

♦ Application Areas: Compound Semiconductors Relevant Industries: Compound Semiconductors

♦ Applicable Material: SiC – Suitable for Processing: Silicon Carbide (SiC)

♦ Wafer Size: 8/6 inches

♦Applicable Process: High-Temperature Annealing Applicable Processes: Annealing of SiC and GaN Wafers

 

Technical Specifications:

♦ Process Temperature Range: 800°C–1600°C

♦ Batch Size: 50 pieces / Batch Capacity: 50 pcs