Shandong Liguan Microelectronics Equipment

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Papua New Guinea LPCVD Equipment

Applicable Fields: Integrated Circuits, Advanced Packaging, Compound Semiconductors Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors Applicable Materials: Si, SiC, GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) Wafer Size: 12/8  inches Applicable Processes: Silicon Nitride (SiN) Deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) Deposition, TEOS Silicon Dioxide Deposition, HTO, and More

Category:

Papua New GuineaHorizontal Furnace Tube Equipment

Papua New GuineaSemiconductor chip equipment

Papua New GuineaLPCVD Equipment

Product Description

Product Applications:

Applicable Fields: Integrated Circuits, Advanced Packaging, Compound Semiconductors Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors

Applicable Materials: Si, SiC, GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN)

Wafer Size: 12/8  inches

Applicable Processes: Silicon Nitride (SiN) deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) deposition, Silicon Dioxide (TEOS) deposition, HTO, and more.

 

 

Technical Indicators:

Process Temperature Range: 500°C–1000°C

Batch Size: 100–150 pieces Batch Capacity: 100–150 pcs