Product display
PRODUCTS CENTER
Papua New Guinea LPCVD Equipment
Category:
Papua New GuineaHorizontal Furnace Tube Equipment
Papua New GuineaSemiconductor chip equipment
Papua New GuineaLPCVD Equipment
Product Description
Product Applications:
Applicable Fields: Integrated Circuits, Advanced Packaging, Compound Semiconductors Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors
Applicable Materials: Si, SiC, GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN)
Wafer Size: 12/8 inches
Applicable Processes: Silicon Nitride (SiN) deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) deposition, Silicon Dioxide (TEOS) deposition, HTO, and more.
Technical Indicators:
Process Temperature Range: 500°C–1000°C
Batch Size: 100–150 pieces Batch Capacity: 100–150 pcs