Shandong Liguan Microelectronics Equipment

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Papua New Guinea Oxidation/Diffusion/Annealing Furnace

Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors Suitable Materials: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) Wafer Size: 12/8 inches Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloy Formation, Diffusion, High-Temperature Annealing

Category:

Papua New GuineaHorizontal Furnace Tube Equipment

Papua New GuineaSemiconductor chip equipment

Papua New GuineaOxidation/Diffusion/Annealing Furnace

Product Description

Product Applications:

♦ Application Areas: Integrated Circuits, Advanced Packaging, Compound Semiconductors Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors

♦ Applicable Materials: Si, SiC, GaN – Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN)

♦ Wafer Size: 12/8 inches

♦ Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloying, Diffusion Applicable Processes: High-Temperature Annealing

 

Technical Parameters:

♦ Process Temperature Range: 300°C–1250°C

♦ Batch Size: 100–250 pieces Batch Capacity: 100–250 pcs