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Uganda ALD Equipment
♦Relevant Industries: Integrated Circuits, Advanced Packaging
♦ Applicable material: Si
♦ Wafer size: 12/8 inches
♦ Applicable processes: Silicon Nitride (SiN)、 Silicon Dioxide（SiO2）, and other film layers
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UgandaALD equipment
Product Description
Product Applications:
♦Relevant Industries: Integrated Circuits, Advanced Packaging
♦ Applicable material: Si
♦ Wafer size: 12/8 inches
♦ Applicable processes: Silicon Nitride (SiN)、 Silicon Dioxide（SiO2）, and other film layers
Technical Indicators:
♦Process Temperature Range: 100°C–350°C
♦Batch Capacity: 50-100 pcs
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