Shandong Liguan Microelectronics Equipment

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sao tome and principe LPCVD Equipment

♦ Relevant Industries: Integrated Circuits, Advanced Packaging ♦Suitable for Processing: Silicon (Si), Silicon Carbide (SiC) ♦ Wafer Size: 12/8 inch

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sao tome and principeSemiconductor chip equipment

sao tome and principeLPCVD Equipment

Product Description

 

Product Applications:

♦Applicable Fields: Integrated Circuits, Advanced Packaging Relevant Industries: Integrated Circuits, Advanced Packaging

♦Applicable Materials: Si, SiC – Suitable for Processing: Silicon (Si), Silicon Carbide (SiC)

♦Wafer Size: 12/8 inches

♦Applicable Processes: Silicon Nitride (SiN) deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) deposition, Silicon Dioxide (TEOS) deposition, HTO, and more.

 

Technical Indicators:

♦ Process Temperature Range: 300°C–1000°C

♦ Batch Size: 100–125 pieces Batch Capacity: 100–125 pcs