Shandong Liguan Microelectronics Equipment

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Oxidation/Diffusion/Annealing Furnace

Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors Suitable Materials: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) Wafer Size: 8/6 inches Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloy Formation, Diffusion, High-Temperature Annealing

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