Shandong Liguan Microelectronics Equipment

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Oxidation/Diffusion/Annealing Furnace

♦ **Application Areas:** Integrated Circuits, Advanced Packaging Relevant Industries: Integrated Circuits, Advanced Packaging ♦ **Applicable Materials:** Si, SiC Suitable for Processing: Silicon (Si), Silicon Carbide (SiC) ♦ **Wafer Sizes:** 12/8/6 inches Wafer Size: 12/8/6 inch ♦ **Applicable Processes:** Oxidation, Annealing, Polyimide Curing, Alloy, Diffusion

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