Shandong Liguan Microelectronics Equipment

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Oxidation/Diffusion/Annealing Furnace

♦ Applicable Fields: Integrated Circuits, Advanced Packaging ♦ Suitable Materials: Si, SiC ♦ Wafer Size: 12/8 inches ♦ Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloy, Diffusion

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