Product classification

Semiconductor chip equipment
- Vertical Furnace Tube Equipment
  - Oxidation/Diffusion/Annealing Furnace
  - LPCVD Equipment
- Horizontal Furnace Tube Equipment
  - Oxidation/Diffusion/Annealing Furnace
  - LPCVD Equipment
Compound Crystal Equipment
- PVT Method Single-Crystal Growth Equipment
- HVPE Method Single-Crystal Growth Equipment

Contact Information

Address: Jinan, Huaiyin District, Jinan City, Jinan Wide Forbidden Belt Semiconductor Industrial Park

Telephone:+86-15562450816

Mailbox:liguan1218@163.com

LPCVD Equipment

Classification:

Horizontal Furnace Tube Equipment

Semiconductor chip equipment

LPCVD Equipment

Summary:

Applicable Fields: Integrated Circuits, Advanced Packaging, Compound Semiconductors Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors Applicable Materials: Si, SiC, GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) Wafer Size: 12/8 inches Applicable Processes: Silicon Nitride (SiN) Deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) Deposition, TEOS Silicon Dioxide Deposition, HTO, and More

Key words:

LPCVD Equipment

Product Applications:

Applicable Fields: Integrated Circuits, Advanced Packaging, Compound Semiconductors Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors

Applicable Materials: Si, SiC, GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN)

Wafer Size: 12/8 inches

Applicable Processes: Silicon Nitride (SiN) deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) deposition, Silicon Dioxide (TEOS) deposition, HTO, and more.

Technical Indicators:

Process Temperature Range: 500°C–1000°C

Batch Size: 100–150 pieces Batch Capacity: 100–150 pcs

Oxidation/Diffusion/Annealing Furnace

None