Product classification
Contact Information
Address: Jinan, Huaiyin District, Jinan City, Jinan Wide Forbidden Belt Semiconductor Industrial Park
Telephone:+86-15562450816
Mailbox:liguan1218@163.com
SiC high temperature oxidation equipment
Classification:
Third generation semiconductor process equipment
First generation semiconductor process equipment
Summary:
Key words:
SiC high temperature oxidation equipment
Product Introduction：
♦Specially used for oxidation treatment of silicon-carbon compounds (SiC), which can realize the high-temperature oxidation process of SiC sheets in high-temperature vacuum environment. The oxidation process uses wet oxidation gas or N₂O, NO and NO₂, which is the safest oxidizing furnace for toxic gas.
♦The equipment is suitable for the high temperature oxidation process in the manufacture of SiC-based power devices
♦The heating chamber and the process chamber are designed independently and sealed to provide the cleanliness of the process chamber
Product characteristics：
♦The vertical structure is adopted, the process is well controlled, the temperature distribution is uniform, and the airflow is stable
♦Robot Auto Transfer (Optional)
♦Multi-point temperature control, uniform temperature
♦Has various alarm functions and safety protection functions
♦The heating chamber and the process chamber are designed independently to provide the cleanliness of the process chamber
Technical Indicators:
|
Wafer size: 4/6 inches |
Operating temperature range: 800-1500°C |
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Loading capacity: 50/80 tablets |
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Scope:
♦ Used for high temperature oxidation treatment of SiC-based semiconductor materials
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SiC High Temperature Annealing Equipment