Product classification

Contact Information

Address: Jinan, Huaiyin District, Jinan City, Jinan Wide Forbidden Belt Semiconductor Industrial Park

Oxidation/Diffusion Equipment

Classification:

First generation semiconductor process equipment

Summary:

♦The equipment is one of the important process equipment before the semiconductor production line, used for large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices and other industries, such as diffusion, oxidation, annealing, alloy and sintering process ♦A variety of process performance requirements for silicon wafer production are designed, which has the characteristics of high growth efficiency and superior product performance ♦It has the advantages of low pollution, small footprint, uniform temperature, large wafer size and high process stability ♦It is mainly used for the preparation process of various oxide dielectric layers such as initial oxide layer, shielding oxide layer, pad oxide layer, sacrificial oxide layer, field oxide layer, etc

Key words:

Oxidation/Diffusion

Oxidation/Diffusion Equipment

Product Introduction：

♦ This equipment is one of the important process equipments in the front process of semiconductor production line, which is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices.

♦ The design takes into account various process performance requirements of silicon wafer production, and has the characteristics of high growth efficiency and superior product performance.

♦ It has the advantages oflow pollution, small occupied area, uniform temperature, large wafer size and high process stability.

♦ Mainly used in the preparation process of various oxidation dielectric layers such as initial oxide layer, shielding oxide layer, gasket oxide layer, sacrificial oxide layer and field oxide layer.

Product Characteristics：

♦ High cleanliness: including materials, process environment, etc.

♦ High precision: including furmace temperature, inlet flow, exhaust pressure, motion control, etc

♦ High safety: including gas leakage detection, airflow detection, man- machine interlocking, etc

Technical Indicators:

Wafer type: 6/8/12 inch wafer	Operating temperature range: 800°C-1250°C
Length of constant temperature zone: ≥860mm	Customized products can be made according to customer requirements

Scope：

♦ It is widely used in oxidation treatment of semiconductor materials, and can also be used in well pushing, annealing, alloying, doping and other processes.

PECVD Horizontal

Vacuum Annealing Equipment