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LPCVD Equipment


Classification:

Horizontal Furnace Tube Equipment

Semiconductor chip equipment

LPCVD Equipment


Summary:

Relevant Fields: Integrated Circuits, Advanced Packaging, Compound Semiconductors Applicable Materials: Si, SiC, GaN Wafer Sizes: 6-inch, 8-inch, 12-inch Applicable Processes: Silicon Nitride (SiN) Deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) Deposition, TEOS Silicon Dioxide Deposition, HTO, and More

Key words:



LPCVD Equipment


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