Shandong Liguan Microelectronics Equipment

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Oxidation/Diffusion/Annealing Furnace

Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors Suitable Materials: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) Wafer Size: 12/8 inches Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloy Formation, Diffusion, High-Temperature Annealing

LPCVD Equipment

Applicable Fields: Integrated Circuits, Advanced Packaging, Compound Semiconductors Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors Applicable Materials: Si, SiC, GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) Wafer Size: 12/8  inches Applicable Processes: Silicon Nitride (SiN) Deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) Deposition, TEOS Silicon Dioxide Deposition, HTO, and More

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