Shandong Liguan Microelectronics Equipment

Product display


SiC High-Temperature Annealing Furnace

♦ Application Fields: Compound Semiconductors Relevant Industries: Compound Semiconductors ♦ Suitable Material: SiC Suitable for Processing: Silicon Carbide (SiC) ♦ Wafer Size: 8/6 inches Wafer Size: 8/6 inch ♦ Applicable Processes: High-Temperature Annealing Applicable Processes: Annealing of SiC and GaN wafers

< 1 > proceed page