Product classification
Contact Information
Address: Jinan, Huaiyin District, Jinan City, Jinan Wide Forbidden Belt Semiconductor Industrial Park
Telephone:+86-15562450816
Mailbox:liguan1218@163.com
SiC seed crystal bonding equipment
Classification:
Compound crystal equipment
Seed crystal bonding equipment
Summary:
Key words:
SiC seed crystal bonding equipment
Product Introduction:
This device bonds SiC seed crystals to graphite using an organic adhesive. Improving the bonding quality of seed crystals is the primary prerequisite to ensure the growth of high quality SiC crystals.
The equipment is to bond SiC seed crystals to graphite by means of an organic adhesive.Improving the bonding quality of seed crystals is the primary prerequisite to ensure the growth of high quality Sic crystals.
Provide 6-8 inches process
Provide 6-8 inches process
Product Characteristics:
- Wafer Size: 6-8 inches
- Temperature Range: 200-800℃, Temperature Uniformity ±3℃
- Pressure: Maximum 20KN, Force Uniformity < ±1%
- Vacuum Pressure: ≤10Pa
- Indenter: Flexible indenter/Rigid indenter
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