Product classification

Contact Information

Address: Jinan, Huaiyin District, Jinan City, Jinan Wide Forbidden Belt Semiconductor Industrial Park

SiC Seed Crystal Bonding Equipment

Classification:

Third generation semiconductor process equipment

Summary:

♦The bonding technology of seed crystal is to bond the SiC seed crystal to the graphite paper by organic glue. Improving the quality of seed bonding is the primary prerequisite to ensure the growth of high-quality SiC crystals.

Key words:

SiC Seed Crystal Bonding

SiC Seed Crystal Bonding Equipment

Product Introduction:

♦ The bonding technology of seed crystal is to bond SiC seed crystal to graphite paper through organic adhesive. Improving the bonding quality of seed crystal is the first prerequisite to ensure the growth of high-quality SiC crystal.

Technical Indicators:

Wafer size: 6-8 inches	Temperature 350 1000°C, temperature uniformity ± 3°C
Speed: Maximum 1-20,000 KN, Force Uniformity<%1%	Population: ≤10Pa
Indenter: Flexible indenter/rigid indenter