Product classification

Semiconductor chip equipment
- Vertical Furnace Tube Equipment
- Horizontal Furnace Tube Equipment
  - Oxidation/Diffusion/Annealing Furnace
  - LPCVD Equipment
Compound Crystal Equipment

Contact Information

Address: Jinan, Huaiyin District, Jinan City, Jinan Wide Forbidden Belt Semiconductor Industrial Park

Telephone:+86-15562450816

Mailbox:liguan1218@163.com

LPCVD Equipment

Classification:

Vertical Furnace Tube Equipment

Product Showcase

Semiconductor chip equipment

LPCVD Equipment

Summary:

♦ **Applicable Fields:** Integrated Circuits, Advanced Packaging Relevant Industries: Integrated Circuits, Advanced Packaging ♦ **Applicable Materials:** Silicon (Si), Silicon Carbide (SiC) Suitable for Processing: Silicon (Si), Silicon Carbide (SiC) ♦ **Wafer Sizes:** 12/8/6 inches Wafer Size: 12/8/6 inch ♦ **Applicable Processes:** Silicon Nitride (SiN) Deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) Deposition, Silicon Dioxide (TEOS) Deposition, HTO, and more

Key words:

LPCVD Equipment

Product Applications:

♦Applicable Fields: Integrated Circuits, Advanced Packaging Relevant Industries: Integrated Circuits, Advanced Packaging

♦Applicable Materials: Si, SiC – Suitable for Processing: Silicon (Si), Silicon Carbide (SiC)

♦Wafer Size: 12/8/6 inches

♦Applicable Processes: Silicon Nitride (SiN) deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) deposition, Silicon Dioxide (TEOS) deposition, HTO, and more.

Technical Indicators:

♦ Process Temperature Range: 300°C–1000°C

♦ Batch Size: 100–125 pieces Batch Capacity: 100–125 pcs

SiC High-Temperature Oxidation Furnace

None